Stagnation-Flow Models

Multiphase Heat Transfer and Fluid Flow

Professor Roger H. Rangel

Assistant Specialist: Xiaoli Bian

Stagnation-Flow Solidification with Undercooling and Contact Resistance

The inviscid stagnation-flow solidification problem is studied numerically including the effect of contact resistance and undercooling during solidification. In addition, the long-time behavior of the process is studied with an analytical method. The effect of contact resistance at the initial liquid-solid contact plane is demonstrated by comparing the solidification behavior for cases with different contact heat transfer coefficient. The effect of undercooling is examined by comparing model predictions including this effect with those obtained when equilibrium solidification with interface temperature at the thermodynamic equilibrium temperature is used. The study shows that undercooling delays the start of solidification but has a negligible effect on the long time behavior of the process. A sufficiently large contact resistance may prevent solidification when undercooling is included in the model. At late stages when substrate remelting occurs, the analytical solution for the long-time behavior of the process indicates that remelting of the substrate proceed at a constant velocity.

References

Figures

Fig. 1 Solid-front time evolution: effect of the substrate/melt contact resistance and undercooling.

Fig. 2 Contact-temperature time evolution: effect of the contact resistance and undercooling, (a) deposit temperature at contact plane; (b) substrate temperature at contact plane. (c) temperature jump at the contact plane.

Fig. 3 Effect of the substrate/melt contact resistance on the time evolution of the solid-front temperature.

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This page has been last updated by XB 9/15/97