Multiphase Heat Transfer and Fluid Flow
Professor Roger H. Rangel
Assistant Specialist: Xiaoli Bian
Stagnation-Flow Solidification with Undercooling and
The inviscid stagnation-flow solidification problem is studied
numerically including the effect
of contact resistance and undercooling during
solidification. In addition, the long-time behavior of the process
is studied with an analytical method.
The effect of contact resistance
at the initial liquid-solid contact plane
is demonstrated by comparing the
solidification behavior for cases with different contact
heat transfer coefficient.
The effect of undercooling is examined by comparing model
predictions including this effect with those obtained when
solidification with interface temperature at the
thermodynamic equilibrium temperature
The study shows that undercooling
delays the start of solidification but
has a negligible effect on the long
time behavior of the process.
A sufficiently large contact resistance may prevent solidification
when undercooling is included in the model.
At late stages when substrate remelting occurs,
the analytical solution for the long-time behavior of the
process indicates that remelting
of the substrate proceed at a constant velocity.
Solid-front time evolution:
effect of the substrate/melt contact resistance
Contact-temperature time evolution:
effect of the contact resistance
(a) deposit temperature at contact plane;
(b) substrate temperature at
(c) temperature jump
at the contact plane.
Effect of the substrate/melt contact resistance on
the time evolution of the solid-front temperature.
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This page has been last updated by XB 9/15/97