Multiphase Heat Transfer and Fluid Flow
Professor Roger H. Rangel --
rhrangel@uci.edu
Jean-Pierre Delplanque --
jpdelp@uci.edu
Spray forming processes have received increased attention
in the field of materials manufacturing because of
their inherent flexibility and because they generate
significant energy and cost savings. A major concern,
however, is the porosity of the resulting materials.
The research effort described herein focuses on the
numerical investigation
of the deformation, interaction and
solidification during substrate impact of molten droplets
in spray processing.
The
deformation and spreading of fully liquid droplets
as they impact onto a flat or
non-flat substrate
was considered first. This analysis was then extended to include
multiple droplet interaction
at impact, and also to account for
solidification.
Emphasis of the on-going work is on the description of
micro-pore formation
and the evaluation of the resulting porosity.
Downloadable Publications
-
Delplanque, J.-P., E. J. Lavernia, and Rangel, R.H.,
"Simulation of micro-pore
formation in spray deposition processes,"
Accepted for presentation at the 1996 ASME IMECE,
Second International Symposium on Multiphase Flows and Heat Transfer in
Materials Processing, Atlanta, GA, November 17-22, 1996.
(4,442K)
-
Delplanque, J.-P., E. J. Lavernia, and Rangel, R.H.,
"Multi-Directional Solidification Model for the Description of
Micro-Pore Formation in Spray Deposition Processes," To appear in
Numerical Heat Transfer, Part A, 1996.
(2,120K)
-
Liu, H., Lavernia, E. J., and Rangel, R. H.,
"Modeling of Molten Droplet Impingement on a Non-Flat Surface",
Acta Metallurgica et Materialia,
43, 5, pp:2053-2072, 1995.
-
Liu, H., Lavernia, E. J., and Rangel, R. H.,
"Numerical Investigation of Micro-Pore Formation
During Substrate Impact of Molten Droplets
in Plasma Spray Processes",
Atomization and Sprays,
4, pp:369-384, 1994.
-
San Marchi, C., Liu, H., Lavernia, E.J., and Rangel, R.H.,
"Numerical Analysis of the Deformation and Solidification of a Single
Droplet Impinging onto a Flat Substrate",
Journal Of Materials Science,
28, pp:3313-3321, 1993
-
Liu, H., Lavernia, E. J., and Rangel, R. H.,
"Numerical Simulation of Impingement of Molten
Ti, Ni, and W Droplet on a Flat Substrate",
Journal of Thermal Spray Technology,
2, 4, pp:369-378, 1993.
-
Liu, H., Lavernia, E. J., and Rangel, R. H.,
"Numerical Simulation of Substrate Impact
and Freezing of Droplets in Plasma Spray Processes",
J. Phys. D: Appl. Phys.,
26, pp:1900-1908, 1993.
A code called RIPPLE (NASA/Los Alamos) is used to simulate
the free surface flow dynamics. The velocity
field inside the deforming liquid droplet is computed as
a solution of the incompressible Navier-Stokes equations.
A Volume of Fluid function is defined in order to track
the location of the free-surface.
RIPPLE was modified to include the solidification process.
A locally one-dimensional solid front advances from the substrate
toward the free surface. Currently, an improved model which
allows for two-dimensional growth of the solid front is
being developed.
Accurate description of the pore formation mechanism
requires a sub-micronic mesh in both axial and radial
directions. Since computations start at the time of
impact, the computation domain must extend axially to include
the complete incident drop. Furthermore, the resulting
splat radial size is typically one order of magnitude larger
than the initial droplet radius. Another constraint arises
from the need for higher accuracy in the evaluation of
surface tension forces which exponentiate at break-up,
thus drastically limiting the magnitude of the maximum time
step. Note that a proper computation of break-up is pivotal
in the determination of porosity.
The calculated results reveal that non-solidifying Ti, Ni,
and W droplets impinging on a flat substrate spread
uniformly in the radial direction and eventually form thin
splats with final diameters and thicknesses up to 11.3 times
and down to 0.02 times the impact diameter, respectively.
The final splat diameter increases rapidly with increasing
impact velocity and melt density or decreasing melt viscosity.
These computations showed that the flattening behavior
is controlled by inertia and viscous effects and yielded
correlations for the final splat diameter and the spreading
time with the Reynolds number.
Simulations of fully liquid droplet impact on a non-flat
substrate showed that, in this case, the flattening behavior
is also controlled by an additional normal stress introduced by the
curved surface. Two mechanisms controlling the spreading process
were identified. If the radial surface roughness is
greater than the initial droplet diameter, periodic
acceleration-decelerations are observed, eventually leading to
violent breakup. Whereas cases with radial surface roughness
smaller than the initial droplet diameter exhibit sheer hindering
of the spreading process. Larger impact velocities, larger roughness
height or smaller radial roughness result in earlier occurrence of
the violent breakup. therefore, decreasing the roughness height or
increasing the radial roughness improves flattening.
If a fully liquid droplet impinging onto a flat substrate leads
to good contact between the splat and the substrate,
multiple fully liquid droplets striking simultaneously onto other
flattening, fully liquid splats cause ejection and rebounding of
the liquid, as well as formation of voids within the liquid.
A combination of a liquid droplet condition at high initial
velocity with a semi-solid or solid surface condition may
produce good adhesion in sprayed deposits or coatings.
When solidification is included, Tungsten droplets are found to spread
and solidify into splats with diameters 1.6 to
3.8 times the initial droplet diameter within a time of 0.12 to 0.44
micro-s.
Preliminary results regarding micropore formation lead to the description
of one mechanism. At impact, the liquid in contact with the
substrate starts to solidify thus forming a solid layer. The
high velocity liquid flowing on top of this layer then detaches
in a manner akin to that observed in liquid-jet overflow.
The liquid layer reattaches to the substrate leaving a gap between
the solidified layer's edge and the reattachment point where
solidification also starts. Finally, multidirectional solidification
may freeze this liquid bridge thus forming a micropore underneath.