Stagnation-Flow Models
Multiphase Heat Transfer and Fluid Flow
Professor Roger H. Rangel
Assistant Specialist: Xiaoli Bian
Liquid Metal Droplet Deposition with Substrate Remelting
Metal droplet deposition is an important process with
several applications in manufacturing. Some of these
applications are encountered in spray and plasma-spray
deposition, and in microcasting and net-shape
manufacturing. When a molten droplet
arrives at the substrate, it undergoes deformation
and solidification. The rates of deformation and
solidification are, in general, of the same order
of magnitude, so it is important to be able to predict
the coupled behavior involving fluid deformation,
heat transfer, and solidification. Typical existing
models have either neglected the deformation by
assuming that it takes place fast or have used
prescribed solutions of the solidification problem
decoupled from the fluid dynamics. The present work
describes a model of droplet deformation and
solidification which includes a solution of the
mechanical energy equation containing kinetic and
potential energy as well as viscous dissipation. In addition,
the transient, convective-diffusive energy equation
including viscous dissipation is solved in the deforming liquid phase
by means of finite differences after appropriate
coordinate transformations.
The solid phase transient energy equation is also
solved in a transformed domain,
and the liquid and solid solutions are coupled
to predict the actual growth of the solidification
front. Because the solid energy equation is solved
in the complete domain, which includes the substrate,
it is possible to predict the conditions for remelting
of the substrate. Parametric studies are presented
for a variety of relevant processing parameters.
References
Figures
Fig. 1 Time evolution of the splat shape formed by liquid aluminum
droplet impinging on a cold substrate (red = liquid, blue = solid).
Fig. 2
Temperature field in the splat and upper substrate
at selected times formed by liquid aluminum
impinging on a cold substrate.
Fig. 3
Time evolution of the splat shape formed by liquid aluminum
droplet impinging on a hot substrate (with remelting).
Fig. 4
Time evolution of
(a) splat radius,
(b) radius expansion rate,
(c) liquid thickness,
and (d) solid fraction for droplet impinging on cold substrate
( case 1: with high impinging velocity, and
case 2: with low impinging velocity).
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This page has been last updated by XB 9/15/97