Research Keyword and microelectronic dielectric materials.
Frank Shi
Publications
Professor
Chemical Engineering and Materials Science
Office: ET 816D
Lab: ET 1001
Lab: ET 1002
Lab: ET 1001
Lab: ET 1002
Professor (Joint Appointment)
Electrical Engineering and Computer Science
Dr. Shi's current research interests include:
- Packaging technologies & design tools for opto, fiberoptic and electronic devices
- Fiber-optic coupling & alignment;
- Active/passive device packaging/reliability;
- Low-cost packaging concepts and design;
- Thermal design;
- Adhesive curing, Laser welding, Soldering;
- Mechanical/thermal stress;
- RF and high frequency electrical packaging issues
- Electronic and photonic packaging materials and design tools
- Photonic glass and other novel materials for electronic, fiberoptic and sensor devices
- IC interconnect, dielectric materials and semiconductor manufacturing issues
Dr. Shi directs the OptoElectronics Integration and Packaging Lab, a research center that serves the evolving needs of the IC and telecommunications industries.
